MX-4 Thermal Compound

Model: MX-4
Gross weight: 0.029kg
Applicable to: Chipset packaging 
Volume: 100mm*160mm*10mm

• The MX-4 convinces everyone with its usual quality and performance, which have always distinguished it. 
• Better Than Liquid Metal: composed of carbon microparticles that lead to extremely high thermal conductivity. It guarantees that the heat generated by the CPU or GPU dissipates efficiently.
• Thermal Compound: the MX-4 formula of the 2019 edition guarantees exceptional heat dissipation of the components and admits the stability necessary to push your system to its limit.
• Secure Application: the MX-4 2019 edition is metal-free and non-conductive, eliminating any risk of causing a short circuit, adding more protection to the CPU and VGA cards.
• Great Durability: in contrast to metal and silicon thermal compound, the MX-4 2019 edition does not compromise with time. Once applied you do not need to reapply it, since it will last at least 8 years.